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NXP doubles production capacity with new innovation for UHF RFID solutions.
October 19, 2016
By: DAVID SAVASTANO
Editor, Ink World Magazine
Avery Dennison and long-standing partner NXP Semiconductors N.V. announced a new industry first innovation, providing 12-inch wafers for long range solutions in addition to the current industry standard 8-inch. This solution will deliver a significant increase in production capacity, improved assembly quality and efficiency, and most importantly, a reduction in manufacturing waste and electricity. Avery Dennison is the first to provide inlays with NXP’s new 12-inch offering. A larger wafer d...
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